当前，随着芯片工艺向先进节点快速演进，制程节点不断逼近物理极限，技术难度呈几何级增长，叠加AI芯片高算力需求、Chiplet多芯片集成等技术趋势，芯片版图复杂度进一步指数级提升，设计与制造环节的协同难度显著加大。

The portable Corkcicle Palmpress pour-over coffee maker is a great gift for travelers and caffeine-lovers alike. It’s an ...

Abstract: Lensless cameras provide a framework to build thin imaging systems by replacing the lens in a conventional camera with an amplitude or phase mask near the sensor. Existing methods for ...

The Joker makeup is genius. The post 12 Easy Halloween Makeup Ideas For 2025 To Wear As Your Costume first appeared on Her ...

Final glue-up on 3D zigzag cutting boards. Available boards include various designs and sizes. #cuttingboards #DIY Police may have found a new serial killer Republicans are ridiculing ‘No Kings.’ A ...

Abstract: The use of laser scanning to generate semiconductor masks is reviewed. Following a brief historical introduction that describes early pattern generator implementations, current and future ...

School of Computer Science and Technology, Changchun University of Science and Technology Changchun, Jilin 130022, P. R. China Changchun Institute of Technology, Changchun, Jilin 130012, P. R. China ...

Moisture is one of the most common causes of printing errors in FFF-3D printers. Technical plastics in particular, such as nylon, PETG or PEEK absorb water from the air, which leads to bubbles, poor ...