Researchers develop a 3D transistor stacking process that boosts performance in flexible and wearable electronics without ...

Infineon’s RIC70847 rad-hard buck controller with an integrated drive targets point-of-load power rails in commercial space ...

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

Artificial Intelligence (AI) is advancing at a remarkable pace. It is becoming smarter, faster, and capable of processing massive amounts of data in ways that were unimaginable a few years ago. From ...

Qualcomm unveiled the Snapdragon 8 Elite Gen 5, its most powerful mobile platform yet, at Snapdragon Summit 2025. This new ...

The CSE (Computer Science Engineering) and ECE (Electronics and Communication Engineering) are two popular engineering ...

In 2024, the global market size of Semiconductor Gases was estimated to be worth USD 4189 Million and is forecast to reach ...

Pioneer of sophisticated fluoropolymer application technologies introduces new self-supporting Flat and High-Flex Cable at ...

Quantum computing is set to redefine data security, AI, and cloud infrastructure. This in-depth research explores how post-quantum cryptography, quantum AI acceleration, and hybrid quantum-cloud ...

The RIC70847 integrates a radiation-hardened 17.1V buck controller with a 5V (output) half-bridge gate drive and is ideal for applications with a power input range of 4.75V to 15V and a power output ...