Researchers develop a 3D transistor stacking process that boosts performance in flexible and wearable electronics without ...

This is a sponsored article brought to you by Siemens. In the world of electronics, integrated circuits (IC) chips are the ...

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

Infineon’s RIC70847 rad-hard buck controller with an integrated drive targets point-of-load power rails in commercial space ...

The CSE (Computer Science Engineering) and ECE (Electronics and Communication Engineering) are two popular engineering ...

In 2024, the global market size of Semiconductor Gases was estimated to be worth USD 4189 Million and is forecast to reach approximately USD 6991 Million by 2031 with a CAGR of 7.7% during the ...

Researchers achieve the first complete 2D flash chip, which can be programmed in 20 nanoseconds with minimal energy ...

Pioneer of sophisticated fluoropolymer application technologies introduces new self-supporting Flat and High-Flex Cable at ...

Quantum computing is set to redefine data security, AI, and cloud infrastructure. This in-depth research explores how post-quantum cryptography, quantum AI acceleration, and hybrid quantum-cloud ...

The RIC70847 integrates a radiation-hardened 17.1V buck controller with a 5V (output) half-bridge gate drive and is ideal for applications with a power input range of 4.75V to 15V and a power output ...