Renesas announced leadership changes to advance its 2035 Aspiration; five new leaders join the Enterprise Leadership Team reporting to CEO.

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

Market is Segmented by Type (Computer Aided Engineering (CAE), IC Physical Design & Verification, Printed Circuit Board (PCB) and Multi-Chip Module (MCM), Semiconductor Intellectual Property (SIP)), ...

Keeping up with the fast-paced world of electronic components can feel like a full-time job. Things are always changing, from ...

The rise and fall of shanzhai phones were swift; they not only created stories of dozens of billionaires emerging from mere "one-meter counters" in Huaqiangbei but also witnessed tragedies like that ...