JDK 25 brings powerful new features to Java and JVM developers. Here are seven new or updated features that could convince ...

Abstract: One of the technical challenges in 2.5D SiP is thermal issue increase with higher performance. In this paper, mass reflow bonding with molded underfll process for chip to wafer stacking of ...

Abstract: Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this ...