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电子工程专辑
13 年
Cadence SiP技术与Allegro Package Designer支持低端IC封装
Cadence 其Allegro 16.6 Package Designer与系统级封装(SiP)布局解决方案支持低端IC封装要求,满足新一代智能手机、平板电脑、超薄 ...
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US strikes kill six
To seek commutation?
Rapper Rod Wave arrested
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Arctic air hits much of US
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Fined for water bottle slam
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